MS2® Dross eliminator
MS2® virtually eliminates solder dross associated with the wave soldering process.
For decades solder dross was an unavoidable – and wasteful – reality in industrial manufacturing. The best a company could do was rely on inefficient powders, oils or mechanical separators to reduce solder loss – until now. MS2® molten solder surfactant doesn't just reduce solder dross associated with wave soldering machines – it actually eliminates it, whether you are working with leaded solder or lead-free alloys. Using less solder means significant cost savings, for companies with just one location or multiple manufacturing facilities.
For decades solder dross was an unavoidable – and wasteful – reality in industrial manufacturing. The best a company could do was rely on inefficient powders, oils or mechanical separators to reduce solder loss – until now.
MS2® molten solder surfactant doesn't just reduce solder dross associated with wave soldering machines – it actually eliminates it, whether you are working with leaded solder or lead-free alloys. Using less solder means significant cost savings, for companies with just one location or multiple manufacturing facilities.
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%MS2® reduces solder usage up to 85%
Every type of manufacturing company recognizes the economic benefits of reducing solder usage. There is significant savings potential acquired from lowering the front-end costs of one of the most volatile areas of electronics manufacturing, automotive manufacturing and other types of manufacturing industries that use metals.
Almost every company employs some method of solder recovery to reduce costs. MS2® can reduce solder usage by 60–85% while also offering additional benefits to the manufacturing process. It is equally effective in both lead-free and leaded solder environments.
MS2® eliminates dross-related soldering defects & rework
Without controls that minimize dross formation, surface oxides form a thicker layer and will most likely be drawn into the solder pumps. That means more dross on or in the solder joints, which can impact performance and reliability.
Dross can also plug wave nozzles, impacting the solder/lead/land interface. Skips and open solder joints may result. If the dross is excessive it can even affect the dynamics of the solder wave peel-off — that means solder bridges or icicles.
MS2® can improve solder joint quality, while reducing dross-related soldering defects, including the contaminating and compromising of solder joints or deposition on the board.
MS2® lowers hazardous waste costs
Managing hazardous waste is expensive and filled with hidden costs for businesses, from those incurred through everyday usage to those associated with packing and shipping.
The most effective way to reduce the impact hazardous waste can have on the company budget is to eliminate the costs upfront whenever possible, especially when dealing with lead-based alloys.
MS2® not only reduces the costs associated with solder usage, it can lower hazardous waste costs as well, in both lead-free and leaded environments.
Works with both leaded & lead-free processes
MS2® works with your evolving manufacturing needs. While a great deal of soldering is still performed in a lead-based environment, global requirements continue to push manufacturers to convert to expensive lead-free solutions. Fortunately, MS2® allows companies to use just one solution regardless of their current or future manufacturing environment, no matter which solder alloy they use now or in the future, thus simplifying workflow and saving both costs and materials.
MS2® is non-toxic, non-volatile & odor-free
Dross reducing solutions that require special considerations and restrictions in handling and usage may end up causing as many problems as they eliminate.
MS2® is non-toxic, nonvolatile and odor-free. That means it’s safe for your employees. With no health-related implementation requirements, it can be efficiently used in your existing work area.
MS2® leaves no residue on electronic components
The electronics industry demands dependable electronic power modules for precise applications in the fields of computing, data processing communications and controls. That makes solder flux residue on printed circuit boards and underneath components an ongoing concern, even after centrifugal cleaning.
It is a primary goal of most electronics manufacturers to reduce the number of quality defects related to solder flux residue under solder joints and low standoff components. These include poor mold component adhesion, improper J-lead attach and electro migration, which can reduce isolation gaps and lead to a short circuit.
MS2® reduces solder flux residue, resulting in less mistakes, easier cleanup and a higher quality look to finished materials.
When used with the New DOFFS equipment MS2 does not even come in contact with your solder pot or your assemblies.
MS2® conforms to your needs with multiple processes
Dross consists of metal oxides plus otherwise good solder metal bound up with the oxides, and thus unavailable for soldering. This metal makes up at least 70% of the dross amount. In a wave solder machine that’s as much as 3 lbs. or more per hour.
When MS2® is added to the solder bath (200–300 ml, once or twice per shift), it prevents dross from forming on the surface, while any dross generated by the exposed solder wave is immediately converted back into usable metal, which thickens until it can be easily skimmed away. The spent material can then be inexpensively shipped back to P. Kay Metal for recycling.
