The electronics industry demands dependable electronic power modules for precise applications in the fields of computing, data processing communications and controls. That makes solder flux residue on printed circuit boards and underneath components an ongoing concern, even after centrifugal cleaning.
It is a primary goal of most electronics manufacturers to reduce the number of quality defects related to solder flux residue under solder joints and low standoff components. These include poor mold component adhesion, improper J-lead attach and electro migration, which can reduce isolation gaps and lead to a short circuit.
MS2® reduces solder flux residue, resulting in less mistakes, easier cleanup and a higher quality look to finished materials.
When used with the New DOFFS equipment MS2 does not even come in contact with your solder pot or your assemblies.