Without controls that minimize dross formation, surface oxides form a thicker layer and will most likely be drawn into the solder pumps. That means more dross on or in the solder joints, which can impact performance and reliability.
Dross can also plug wave nozzles, impacting the solder/lead/land interface. Skips and open solder joints may result. If the dross is excessive it can even affect the dynamics of the solder wave peel-off — that means solder bridges or icicles.
MS2® can improve solder joint quality, while reducing dross-related soldering defects, including the contaminating and compromising of solder joints or deposition on the board.